Tuck Point Blades - Wafer Segmented
Reference MQ Diamond Tool Brochure Pages: 21
- DRY/WET Cutting - Premium Grade
- Wafer blade design for lightning fast material removal.
- Cleans, routs mortar and masonry materials.
- 1/4 and 3/8 in wafer widths available.
- Blade Diameters for Right Angle Grinders & Circular Saws.
- Reference Series: WTK
Notice: Features and equipment specifications are subject to change without notice.
