Tuck Point Blades - Wafer Segmented

Tuck Point Blades - Wafer Segmented

Reference MQ Diamond Tool Brochure Pages: 21
  • DRY/WET Cutting - Premium Grade
  • Wafer blade design for lightning fast material removal.
  • Cleans, routs mortar and masonry materials.
  • 1/4 and 3/8 in wafer widths available.
  • Blade Diameters for Right Angle Grinders & Circular Saws.
  • Reference Series: WTK


 
 
Notice: Features and equipment specifications are subject to change without notice.